2.Turn on theHeat Gun,the temperature was set to 280°C, the air flow was set to3, and the 8mm nozzle was used.
3.Solder complete in a few seconds.
10CC BGA syringe plunger + dispenser needle solder paste, available for PCB BGA soldering and repairing.
Good adhesion. Paste delicate, particles small, only 20~38 microns.
Excellent wettability.After opening, the surface remains moist for 36 hours. Does not affect the welding.
Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding
High quality, perfect performance, easy to weld, no false welding phenomenon
The residue is colorless and transparent and does not affect the detection. It has excellent cleaning performance in one time.
Suitable for mobile phone repair industry, computer digital service industry, high-precision circuit board SMT welding, BGA welding technology and so on.
Material: BGA 183℃ Soldering Paste
Type: Solder paste
Design: Squeeze tube needle dispenser
Net Weight: 35g
Application: for Phone PCB BGA circuit board repairing
Usage: PCB BGA soldering tool
What's in the Package
1pcs x 10ML Dispenser ( Squeeze Tube /Plunger)
1pcs x Needle Heads
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